Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
Avoid ultrasonic
cleaning relays.
• Although slightly difficult apply, does not affect relay contacts. Use ultrasonic
cleaning may cause breaks the coil
or slight sticking the contacts due to
the ultrasonic energy.
Do not coat dust-cover type relays and
flux-resistant type relays, since the
coating material may penetrate the
relay and cause contact failure. Even only the bottom
surface the board cleaned
(e.
Depending the type, some coating
materials may have adverse affect
on relays. heck before use.
If the relay and all com ponents (e.g.g. Or,
mount the relay after coating.
Silicone-base Good
• Silicone gas becom the cause contact failure.
6 g
Do not clean dust-cover type relays
and flux-resistant type relays by
immersion. Trichlene,
chloroethene, thinner, benzyl alcohol,
gasoline) may damage the relay case.
• Solvent may dam age case.
ICs) are coated, sure to
carefully check the flexibility the
coating material.
Type
Suitability
for Relays
Features
Epoxy-base Good
• Good electrical insulation.
• not cut the terminals.
Select coating materials carefully.P.g. with brush), careless cleaning
may cause cleaning solvent to
penetrate the relay.
Plastic sealed type relays can be
cleaned immersion.
Do not use the silicone-base type.
• Cleaning with the boiling method is
recommended.
32 ds_x61_en_relay_technical_information_091112D
.Relay Soldering and Cleaning Guidelines
5 lin g
A tic g
Immediate air cooling recommend to
prevent deterioration the relay and
surrounding parts due soldering
heat.g.
xylene, toluene, MEK, I.)
can cleaned, avoid immersing the
relay into cold liquid (such cleaning
solvent) ediately after soldering.
If the relay and all com ponents (e.A. Use Freon- or
alcohol-based cleaning solvent. hen
term inals are cut, breaking coil wire
and slight sticking the contacts may
occur due vibration the cutter.
Doing may deteriorate the sealing
performance. The solder may peel
off from therm stress.
U rethane-base Care
• Good electrical insulation, easy apply.) may
damage the case chem ically
dissolve the epoxy and break the seal. The solder may peel
off from therm stress.
7 tin g
If the board coated to
prevent the insulation the board
from deteriorating due corrosive
gases and high tem peratures, note the
following.
ICs) are coated, sure to
carefully check the flexibility the
coating material. Use of
other cleaning solvents (e. Furthermore, solvents (e.g.
Although the environm entally sealed
type relay (plastic sealed type, etc
