Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
Relay Clip resistance
PCboard ''
2 ffe ts
Features Effects
• Allows high density mounting
• Components can installed both sides board
• Ceramic boards can used
t
System downsizing
• Compatible with automatic placement robots
• Drilling for lead holes not required
• Compact system designs are possible due high density mounting
Overall cost reduction
• High heat resistance
• Anti-gas measures
High reliability
_The surface mount relay anufactured with
the following advanced technologies:
Heat-resistance encapsulation technique
Gas analysis
Reliability assessm ent
Precision molding technique for heat-
resistant materials
3 lic tio s
The following describes some examples
of typical SMT applications:
• Infrared Reflow Soldering (IRS)
IRS the most popular reflow soldering
technology now available for surface
mounting.
W applied the experience gained from
our advanced relay technologies to
produce high-perform ance
electrom agnetic relays com patible with
surface mount technologies such IRS
and VPS.
• tio (IM .
products, boards also need mount relays. PC
board assem blies are continuously
soldered they are transferred through
a tunnel furnace comprised a
preheating, heating, and cooling-stages. uses sheath heater or
infrared lamp its heat source. In
contrast, the conventional electro
mechanical relays consisting solenoid
coils, springs, and arm atures are very
sensitive therm stress from reflow
soldering. The board assem bly is
transferred through molten solder
fountain (with the com ponent side facing
down), and the com ponents are soldered
to the board. T
Conventional insertion mount technology
(IMT) with some years history is
now being replaced with surface mount
technology (SMT).
ds_x61_en_relay_technical_information_091112D 33
.
As PCB assem blies are transferred a
thin, heat-resistant belt conveyer, they
are soldered the heat from hotplates
placed begeath the conveyer belt. meet mount relay installation prevent
downsizing smaller, lighter, and thinner this need, offer line surface malfunction and incorrectoperation.
S )
Insertion Mounting
Technology (IMT)
Components’ leads are inserted into
lead holes drilled into the board
and are soldered copper pads on
the other side the board using
flow-soldering techniques.SMT Soldering Guidelines
SMT SOLDERING GUIDELINES
CAUTIONS FOR SURFACE MOUNT RELAY INSTALLATION
To meet the market demand for surface mounting technology.
• Other Technologies
Other reflow soldering technologies
include those utilizing lasers, hot air, and
pulse heaters. the
saturated vapor condenses the PC
board surface, the resulting evaporation
heat provides the energy for reflow
soldering.
Solid-state com ponents such as
resistors, ICs, and diodes can withstand
high heat stresses from reflow soldering
because they use mechanical parts. The following describes
proceed from Insertion mounting some cautions required for surface
[1] What Surface Mount Relay?
1.
W ith VPS technology, PCB assemblies
are carried through special inactive
solvent, such Fluorinert FC-70, that
has been heated vapor state.
• Double ave Soldering (DW S)
Com ponents are glued the board
surface.
Relay Resistor
PC board
Surface Mount Technology
(SMT)
Components are placed copper
pads precoated with paste solder
and the board assembly heated to
solder the components the pads
(reflow soldering)
