RELAYS Panasonic

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Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.

Vydal: Panasonic Electric Works Czech s.r.o. Autor: Panasonic

Strana 970 z 1090

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Relay performance may degrade due the high thermal capacity these boards. minutes • Note that long exposure high tem peratures (e. Please refer them during installation in order avoid problems. See “Configuration and Construction” page 1. This must observed especially for dust-cover type relays. Solderability also improves. (Be sure that the relays don't rattle. due a malfunctioning unit) may affect relay characteristics. This could impair relay performance. Note that the board is pressed down hard enough, flux may even penetrate flux-resistant type relay. ^ . 1. Please review the parts construction and characteristics. tin y r u u • Avoid bending the term inals make the relay self-clinching. • Use rosin-based non-corrosive flux. • Stick packaging also available for autom atic mounting, depending the type relay. Solder temperature 260°C±5°C 500°F±41°F Soldering time Within approx. Relay perform ance cannot guaranteed if the term inals are bent. Adjust the level solder that does not overflow onto the top the PC board. Temperature 120°C 248°F less Time Within approx. • the board pressed down into a flux-soaked sponge shown the right, the flux can easily penetrate a dust-cover type relay. ith this style, loss function may occur because of seepage into the relay flux, which is applied the board. seconds ds_x61_en_relay_technical_information_091112D 31 . • Correctly drill the board according to the given board pattern illustration. Unless otherwise specified, solder under the following conditions depending the type relay.) Interference may occur internally the gripping force the tab of the surface mounting machine too great.Relay Soldering and Cleaning Guidelines RELAY SOLDERING AND CLEANING GUIDELINES In keeping with making devices compact, it becoming more common weld the relay board along with the sem iconductors instead using the previous plug-in type which relays were plugged into sockets. For dust-cover type relays and flux-resistant type relays, preheating acts prevent the penetration flux into the relay when soldering. • Preheat according the following conditions. seconds Please take caution with ulti-layer boards. 4 g A tic g Flow solder the optim method for soldering. Therefore, the following precautions are provided for soldering relay onto board. Never use this method. ( \ Bad example 2 lic tio n • Adjust the position the board so that flux does not overflow onto the top of it.g. • g Keep the tip the soldering iron clean. The type protective structure will determine suitability for automatic soldering autom atic cleaning.V4J Bad example 3 tin g r U U n 7 Be sure preheat before using autom atic soldering. Soldering Iron 30W 60W Iron Tip Temperature 350°C 662°F Soldering Time Within approx. Self-clinching term inal types are available depending on the type relay