Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
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• Adjust the position the board so
that flux does not overflow onto the top
of it. Therefore, the
following precautions are provided for
soldering relay onto board. See “Configuration and
Construction” page 1.) Interference may occur
internally the gripping force the tab
of the surface mounting machine too
great.
• Preheat according the following
conditions. For dust-cover
type relays and flux-resistant type
relays, preheating acts prevent the
penetration flux into the relay when
soldering. Solderability also improves. tin y
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• Avoid bending the term inals make
the relay self-clinching. Please
review the parts construction and
characteristics. Self-clinching
term inal types are available depending
on the type relay.
Unless otherwise specified, solder
under the following conditions
depending the type relay.
The type protective structure will
determine suitability for automatic
soldering autom atic cleaning. ith this
style, loss function may occur because
of seepage into the relay flux, which is
applied the board.
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Keep the tip the soldering iron clean.V4J
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Be sure preheat before using
autom atic soldering. due a
malfunctioning unit) may affect relay
characteristics.
• Correctly drill the board according
to the given board pattern
illustration. Never use this
method. seconds
Please take caution with ulti-layer
boards.
Please refer them during installation in
order avoid problems. Relay
perform ance cannot guaranteed if
the term inals are bent. seconds
ds_x61_en_relay_technical_information_091112D 31
.Relay Soldering and Cleaning Guidelines
RELAY SOLDERING AND CLEANING GUIDELINES
In keeping with making devices compact,
it becoming more common weld the
relay board along with the
sem iconductors instead using the
previous plug-in type which relays
were plugged into sockets. (Be sure that the relays
don't rattle. This must observed especially
for dust-cover type relays.
• Use rosin-based non-corrosive flux.
^ .
Solder
temperature
260°C±5°C 500°F±41°F
Soldering time Within approx. This could impair relay
performance.
Adjust the level solder that does
not overflow onto the top the PC
board. Relay performance may
degrade due the high thermal
capacity these boards.
• the board pressed down into a
flux-soaked sponge shown the
right, the flux can easily penetrate a
dust-cover type relay.
1.
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Flow solder the optim method for
soldering.
• Stick packaging also available for
autom atic mounting, depending the
type relay.
Temperature 120°C 248°F less
Time Within approx.g. minutes
• Note that long exposure high
tem peratures (e.
Soldering Iron 30W 60W
Iron Tip
Temperature
350°C 662°F
Soldering Time Within approx. Note that the board is
pressed down hard enough, flux may
even penetrate flux-resistant type
relay
