Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
Prevents contact area from solder
rise.
Influence solder controlled contact
and contact spring parts.
MIPTEC technology
3D fine pattern
3D fine patterning achieved the high accuracy laser processing technology
(circuit idth/distance between circuit 50pm /50pm olded com ponent pattern
accuracy 30pm ). Solder remains
inthe terminals and stable fillet mold
is possible. Simple lock
structure
Double contact
The two-point contact structure provides
high contact reliability even though the
profile ultra-lowat 0.This area prevents
solder rise, which conventional
ultra-low-profile connectors are prone.6mm.
The simple lock structure gives tactile
feedback that ensures superior mating/
unmating operation feel.
TOUGHCONTPC RDl/PNCED
Tough against foreign particles and flux
Prevents foreign substances from contact area, doubles the
contact points and increases contact pressure
Tough against corrosive gases
Porosity treatm ent ensures high contact
reliability sealing pinholes the gold plating.Advanced technologies
Tough Contact Advanced technology
Tough against dropping
Bellows contact construction
improves the ability withstand
twisting and increased resistance
to shock dropping.
Direct bare chip mounting
Direct ounting chips achieved with resin aterial featuring low linear
expansion coefficient. bined with surface activation technology, this en
sures oothness circuit surfaces.
Tough against solder rise
Solder remains the term inal
area and stable fillet the
soldering joints possible.
3Dfine pattern Direct bare chip mounting
11
. The structure
blocks flux and foreign substances, with
an effect equivalent that our unique
V-notch structure.
U AU
\ /
Exposed
NI portion
An area where the nickel-plated layer is
exposed has been secured inthe middle
of the socket contact.
High ounting reliability (low coefficient linear expansion), high therm resistance/
high heat dissipation, good high frequency characteristics.
Ceramic MID
C apable form ing fine patterns surfaces ade ceram well resin
