Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
Boiled cleaning approved for surface
mount relays. Check for the specific
mounting condition.
69
.
• Paste solder may applied the
board with screen printing dispenser
techniques.8 (less than 1,000 gf)
DirectionB: Less than 9.
T2 230°C 46' more Less than sec.
• Others
W hen soldering technique other than
above used (hot air, hotplate,
laser, pulse heater technique),
carefully investigate the suitability of
the technique. For either method, the
paste solder must coated to
appropriate thickness and shapes to
achieve good solder wetting and
adequate insulation.
Our SMT relays are supplied stick
packaging compatible with autom atic
placem ent processes. Ultrasonic cleaning may
cause coil damage light contact
sticking.
Example Recommended Soldering
Condition for Surface Mount Relays. also offer
tape packaging custom request. some
cases, the ambient tem perature may be
greatly increased.8 N(lessthan1,000 gf)
C b
A B
(ex. efer the suggested
mounting pad layout the application
data for the required relay product.Excerpts from Technical Information
[2] Cautions for installation
• Mounting pads boards must be
designed absorb placement errors
while taking account solderability
and insulation.
T3 Less than 250°C 482°F
soldering conditions may result in
unreliable relay performance even
physical damage the relay (even the
relay surface mount type with high
heat resistance). TQ-SMD Relay)
IRS technique
Ti 150 180"C 302 356°F 120 sec. Use alcohol equivalent
solvent for cleaning.8 (less than 1,000 gf)
Direction Less than 9.
Note:
The soldering tem perature profile
indicates the pad temperature.
Holding Pressure
DirectionA: Less than 9.
The surface mount relays are solvent
washable.
-■I I1-
Note
t------------------------------------- \
It recommended that the soldered
pad ediately cooled to
prevent therm damage the relay
and its associated components.
If relays sustain excessive
mechanical stress from the placement
machine's pickup head, their
performance cannot guaranteed. However,
this effect not expected for
electro-m echanical com ponents such
as relays, and they require precise
positioning their soldering pads.
W hile surface mount relays are
solvent washable, not immerse
the relay cold cleaning solvent
im ediately after soldering.
• Manual soldering
- Soldering iron tip temperature:
350°C 662°F
- Soldering iron wattage: 60
watts
- Soldering time: Less than sec.
For small, lightweight components
such chip components, self
alignm ent effect can expected if
small placement errors exist
