RELAYS Panasonic

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Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.

Vydal: Panasonic Electric Works Czech s.r.o. Autor: Panasonic

Strana 920 z 1090

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For small, lightweight components such chip components, self­ alignm ent effect can expected if small placement errors exist. • Others W hen soldering technique other than above used (hot air, hotplate, laser, pulse heater technique), carefully investigate the suitability of the technique. efer the suggested mounting pad layout the application data for the required relay product. T2 230°C 46' more Less than sec. However, this effect not expected for electro-m echanical com ponents such as relays, and they require precise positioning their soldering pads. TQ-SMD Relay) IRS technique Ti 150 180"C 302 356°F 120 sec. The surface mount relays are solvent washable.8 (less than 1,000 gf) Direction Less than 9. Ultrasonic cleaning may cause coil damage light contact sticking.8 (less than 1,000 gf) DirectionB: Less than 9. T3 Less than 250°C 482°F soldering conditions may result in unreliable relay performance even physical damage the relay (even the relay surface mount type with high heat resistance). Boiled cleaning approved for surface mount relays. some cases, the ambient tem perature may be greatly increased. Our SMT relays are supplied stick packaging compatible with autom atic placem ent processes. also offer tape packaging custom request.Excerpts from Technical Information [2] Cautions for installation • Mounting pads boards must be designed absorb placement errors while taking account solderability and insulation. Holding Pressure DirectionA: Less than 9. Check for the specific mounting condition. If relays sustain excessive mechanical stress from the placement machine's pickup head, their performance cannot guaranteed. 69 . • Manual soldering - Soldering iron tip temperature: 350°C 662°F - Soldering iron wattage: 60 watts - Soldering time: Less than sec. Note: The soldering tem perature profile indicates the pad temperature. Use alcohol equivalent solvent for cleaning. -■I I1- Note t------------------------------------- \ It recommended that the soldered pad ediately cooled to prevent therm damage the relay and its associated components. For either method, the paste solder must coated to appropriate thickness and shapes to achieve good solder wetting and adequate insulation. W hile surface mount relays are solvent washable, not immerse the relay cold cleaning solvent im ediately after soldering. • Paste solder may applied the board with screen printing dispenser techniques. Example Recommended Soldering Condition for Surface Mount Relays.8 N(lessthan1,000 gf) C b A B (ex