Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
meet mount relay Installation prevent
downsizing smaller, lighter, and thinner this need, offer line surface malfunction andincorrect operation.
W applied the experience gained from
our advanced relay technologies to
produce high-perform ance
electrom agnetic relays compatible with
surface mount technologies such IRS
and VPS. PC
board assemblies are continuously
soldered they are transferred through
a tunnel furnace comprised a
preheating, heating, and cooling-stages.
W ith VPS technology, PCB assemblies
are carried through special inactive
solvent, such Fluorinert FC-70, that
has been heated vapor state.
As PCB assem blies are transferred a
thin, heat-resistant belt conveyer, they
are soldered the heat from hotplates
placed begeath the conveyer belt. uses sheath heater or
infrared lamp its heat source.
• Other Technologies
O ther reflow soldering technologies
include those utilizing lasers, hot air, and
pulse heaters. In
contrast, the conventional electro
mechanical relays consisting solenoid
coils, springs, and armatures are very
sensitive therm stress from reflow
soldering.
• tio (IM )
Insertion ounting
Technology (IM T)
Surface ount Technology
(SMT)
C ponents’ leads are inserted into
lead holes drilled into the board
and are soldered copper pads on
the other side the board using
flow -soldering techniques. The following describes
proceed from Insertion mounting some cautions required for surface
[1] What Surface Mount Relay?
1. T
Conventional insertion mount technology
(IMT) with some years history is
now being replaced with surface mount
technology (SMT). the
saturated vapor condenses the PC
board surface, the resulting evaporation
heat provides the energy for reflow
soldering.
products, boards also need mount relays.Excerpts from Technical Information
SMT SOLDERING GUIDELINES
CAUTIONS FOR SURFACE MOUNT RELAY INSTALLATION
To meet the market demand for surface mounting technology.
• Double ave Soldering (DWS)
Com ponents are glued the board
surface. The board assem bly is
transferred through molten solder
fountain (with the com ponent side facing
down), and the components are soldered
to the board.
I Relay
T P
PC board
Relay Clip resistance
Resistor
C
2 ffe ts
Features Effects
• llow high density ounting
• Com ponents can installed both sides board
• eram boards can used
System downsizing
• Com patible with autom atic placem ent robots
• Drilling for lead holes not required
• pact system designs are possible due high density ounting
O verall cost reduction
• High heat resistance
• nti-gas easures
High reliability
The surface mount relay anufactured with
the following advanced technologies:
Heat-resistance encapsulation technique
G analysis
Reliability assessment
Precision molding technique for heat-
resistant materials
3 lic tio s
The following describes some examples
of typical SMT applications:
• Infrared Reflow Soldering (IRS)
IRS the most popular reflow soldering
technology now available for surface
mounting.
68
.
Solid-state com ponents such as
resistors, ICs, and diodes can withstand
high heat stresses from reflow soldering
because they use mechanical parts.
Com ponents are placed copper
pads precoated ith paste solder
and the board assem bly heated to
solder the com ponents the pads
(reflow soldering)
