OMNIMATE – Device connectivity and electronics housings

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Weidmüller is a leading international provider of solutions for electrical connectivity,transmission and conditioning of power, signal and data in industrial environments.The company with headquarters in Detmold/Germany develops, produces and sellsproducts in the field of electrical connectivity and electronics all over the world.

Vydal: Weidmüller, s.r.o. Autor: Weidmueller

Strana 627 z 707

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control the quality of the PCB construction, the pull out strength the solder pins from the solder joint tested. • The vertical solder filling must least 75%. the insertion side from the view the component), connection and sleeve should not less than 270°. The following values are set for the five assessment criteria: • The primary side solder wetting coverage (i. • Solder joints the primary side are, however, not required. Measuring the filling level through hole solder joints according IPC-A-610E • The secondary side solder wetting coverage (i. should noted that, in the THR process, there are typically two different construction types: • Short pins when compared the PCB thickness • Longer pins when compared the PCB thickness (about 1. According IPC-A-610E quality requirements, THR solder joints are divided into three classes. remains the original ring the THR solder joint) the primary side 0%. In comparison, For surface connections for SMD components the required pull- out strength only about N.3.3 the use of pins that are shorter than the PCB thickness permissible in principle. For long pins, there are the following requirements: • The solder joints the secondary side must visible. addition other acceptance criteria for the manufacturing electronic components, the quality control assessment criteria the IPC-A-610E Norm are globally recognised.W.5 protrusion) For short pin construction there are the following requirements: • The solder joints the primary side the PCB must be visible. These standards produce many demands the wired components the quality control. For industrial applications where high power demands are made, Class the usual requirement.e. • Solder wetting the solder pads (i.e.17 Technicalappendix W Norms and standards: To make quality control more objective, norms and standards have been introduced over the recent years. Additionally, destructive testing with THR components there are requirements placed the PCB itself.e. 75 % SMT design-in recommendations . According IPC-A-610 Revision E-2010, section 7. Required pull out strength: • with short pins: approximately 150 N. the underside from the view the component) should not be less than 330°. • for long pins with solder meniscus the primary and secondary sides: approximately 220 N. • For components with pins under the insulating body, the height the component over the PCB must sufficient to allow optical inspection. • Solder wetting the solder pads the secondary side must be least 75%