Weidmüller is a leading international provider of solutions for electrical connectivity,transmission and conditioning of power, signal and data in industrial environments.The company with headquarters in Detmold/Germany develops, produces and sellsproducts in the field of electrical connectivity and electronics all over the world.
control the quality
of the PCB construction, the pull out strength the solder pins
from the solder joint tested.
According IPC-A-610 Revision E-2010, section 7.
• for long pins with solder meniscus the primary and
secondary sides: approximately 220 N.
In comparison,
For surface connections for SMD components the required pull-
out strength only about N.
75 %
SMT design-in recommendations
.
Required pull out strength:
• with short pins: approximately 150 N.e.3 the use
of pins that are shorter than the PCB thickness permissible in
principle.e. remains the original
ring the THR solder joint) the primary side 0%.
Additionally, destructive testing with THR components there
are requirements placed the PCB itself.
Measuring the filling level through hole solder joints
according IPC-A-610E
• The secondary side solder wetting coverage (i.
• Solder wetting the solder pads the secondary side must
be least 75%. should noted that, in
the THR process, there are typically two different construction
types:
• Short pins when compared the PCB thickness
• Longer pins when compared the PCB thickness
(about 1. the insertion
side from the view the component), connection and sleeve
should not less than 270°.5 protrusion)
For short pin construction there are the following requirements:
• The solder joints the primary side the PCB must be
visible.
According IPC-A-610E quality requirements, THR solder
joints are divided into three classes.
• Solder wetting the solder pads (i.
• For components with pins under the insulating body, the
height the component over the PCB must sufficient to
allow optical inspection.e.17
Technicalappendix
W
Norms and standards:
To make quality control more objective, norms and standards
have been introduced over the recent years. the
underside from the view the component) should not be
less than 330°.
For long pins, there are the following requirements:
• The solder joints the secondary side must visible.
• The vertical solder filling must least 75%. addition
other acceptance criteria for the manufacturing electronic
components, the quality control assessment criteria the
IPC-A-610E Norm are globally recognised.
• Solder joints the primary side are, however, not required. The following values are set for the five
assessment criteria:
• The primary side solder wetting coverage (i. For industrial applications
where high power demands are made, Class the usual
requirement.W.
These standards produce many demands the wired
components the quality control.3
