Weidmüller is a leading international provider of solutions for electrical connectivity,transmission and conditioning of power, signal and data in industrial environments.The company with headquarters in Detmold/Germany develops, produces and sellsproducts in the field of electrical connectivity and electronics all over the world.
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Measuring the filling level through hole solder joints
according IPC-A-610E
• The secondary side solder wetting coverage (i.5 protrusion)
For short pin construction there are the following requirements:
• The solder joints the primary side the PCB must be
visible.e.
Required pull out strength:
• with short pins: approximately 150 N.
For long pins, there are the following requirements:
• The solder joints the secondary side must visible.3. control the quality
of the PCB construction, the pull out strength the solder pins
from the solder joint tested.
75 %
SMT design-in recommendations
. should noted that, in
the THR process, there are typically two different construction
types:
• Short pins when compared the PCB thickness
• Longer pins when compared the PCB thickness
(about 1.
In comparison,
For surface connections for SMD components the required pull-
out strength only about N. The following values are set for the five
assessment criteria:
• The primary side solder wetting coverage (i.3 the use
of pins that are shorter than the PCB thickness permissible in
principle.
According IPC-A-610E quality requirements, THR solder
joints are divided into three classes.
Additionally, destructive testing with THR components there
are requirements placed the PCB itself.17
Technicalappendix
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Norms and standards:
To make quality control more objective, norms and standards
have been introduced over the recent years. remains the original
ring the THR solder joint) the primary side 0%. the
underside from the view the component) should not be
less than 330°.
• Solder wetting the solder pads (i. the insertion
side from the view the component), connection and sleeve
should not less than 270°. addition
other acceptance criteria for the manufacturing electronic
components, the quality control assessment criteria the
IPC-A-610E Norm are globally recognised.
• The vertical solder filling must least 75%.
• Solder wetting the solder pads the secondary side must
be least 75%.
• Solder joints the primary side are, however, not required.
These standards produce many demands the wired
components the quality control.
• For components with pins under the insulating body, the
height the component over the PCB must sufficient to
allow optical inspection.
• for long pins with solder meniscus the primary and
secondary sides: approximately 220 N.e.
According IPC-A-610 Revision E-2010, section 7.e. For industrial applications
where high power demands are made, Class the usual
requirement
