OMNIMATE – Device connectivity and electronics housings

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Weidmüller is a leading international provider of solutions for electrical connectivity,transmission and conditioning of power, signal and data in industrial environments.The company with headquarters in Detmold/Germany develops, produces and sellsproducts in the field of electrical connectivity and electronics all over the world.

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weidmueller.com Design recommendations Male connector parameters Pin cross-section PCB parameters Stencil parameters Optimum solder joint form .3 Pin diameter [mm] 1. 0.5+0.W.1 mm3 / % 3. We recommend determining the quantity solder paste follows: Volume paste (or rather, degree filling): for solder joint filling and solder joint form within the tolerances IPC-A610 Male conn.3 Min.9 mm3 / % 3.5 mm3 / 100 % Valid with the following parameters for all SL-SMT variations: Male connector: Pin length [mm] 1. (solder flange LF): 2 poles – 9 poles 2 poles Recommended finished hole I.1 mm Paste volume [mm3 ] filling level [%] after stencil print Minimum solder joint shape Optimum solder joint shape 2.15 Technicalappendix W SMT design-in recommendations Solder paste volume and filling degree for 1. The volume paste and hence the degree filling the solder paste the paste printing method critical for optimum soldering results the SMT process.1 mm 1.4+0.1 mm 2 ) Stencil hole diameter approx.2 pin diameter.5+0. 50 Process: Stencil print method squeegee print, single Filling level placement hole [%] see table Method for automatic assembly pick&place Temperature profile 61760-1 1 ) Tolerances for components, PCBs and automatic machines must taken into account: recommendation for poles more, for variations with solder flange LF: 1.2 PCB: Thickness [mm] 1.3 Positioning tolerance IEC 326-3 very fine Stencil: Thickness DS [µm] 120 180 Stencil hole diameter [mm] 2.D. 10% smaller than placement hole outer diameter dA Recommendations for S2L-SMT and SC-SMT 3. *1) : dI 1. height space without paste hL [mm] min. (open and closed): Male conn.6 Placement hole metallised Placement hole inner diameter ID dI [mm] see table 1 ) Placement hole outer diameter OD dA [mm] 2.81 see: http://catalog.1 2 ) Solder paste: Solder paste particle size [µm] Type 3 Evaporation volume solder paste [%] approx.4 mm3 / % 2.5-0

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