OMNIMATE – Device connectivity and electronics housings

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Weidmüller is a leading international provider of solutions for electrical connectivity,transmission and conditioning of power, signal and data in industrial environments.The company with headquarters in Detmold/Germany develops, produces and sellsproducts in the field of electrical connectivity and electronics all over the world.

Vydal: Weidmüller, s.r.o. Autor: Weidmueller

Strana 622 z 707

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the same time this ensures 100% compatibility with the SMT process. The progress made the development of surface mounted devices (SMD), that allowed the devlopment of the SMT manufacturing process the first place has also played role. Benefits THR: • stable connection the PCB • only one soldering process • longer need for hand wave soldering • automatic assembly • lower production costs In order use THR components the SMT process, they must meet certain requirements. SMT now the accepted standard PCB manufacturing. The THR procedure came from the awareness that for heavy components such coils transformers and anywhere where there mechanical forces act the (for example, terminals, connectors, relay sockets etc. THR ensures stable connection the THT components the PCB using the push-through pins.W.), still required stable solder connections. Weidmüller has developed product range for the through hole reflow process (THR), this makes wired component parts usable the SMT process and allows100% processing the SMT production line. There are still some components, the main electro-mechanical components like connectors relays, which are not available SMD version, they are therefore mounted following the SMT process using the classical THT assembly onto the PCB.12 Technicalappendix W SMT design-in recommendations Weidmüller connectors the reflow soldering process The PCB assembly process has undergone fundamental change recent years. SMT compatible product always compromise between optimal SMT capability and the stability the solder connection. Through hole reflow method connect THT components with the SMT reflow solder process. Supplementary to conventional SMD assembly, the THR method allows SMD components and wired components placed the SMT printed-circuit board and soldered using the reflow process. The conventional through-hole mounting technology (Through Hole Technology, THT) has been increasingly replaced surface mounting technology (SMT). The reasons for this was the increasing demands of miniaturisation, higher functional density and lower manufacturing costs. SMD solder connections are not suitable for heavy components terms their mechanical strength.