RELAYS Panasonic

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Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.

Vydal: Panasonic Electric Works Czech s.r.o. Autor: Panasonic

Strana 917 z 1090

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due a malfunctioning unit) may affect relay characteristics. For dust-cover type relays and flux-resistant type relays, preheating acts prevent the penetration flux into the relay when soldering. Please refer them during installation in order avoid problems. Soldering Iron 60W Iron Tip Tem perature 350°C 662°F Soldering Time ithin approx. J Be sure preheat before using autom atic soldering. ith this style, loss function may occur because of seepage into the relay flux, which is applied the board. ♦ Bad exam ple 3 tin g r U U n uV. tin y f u u • Avoid bending the term inals make the relay self-clinching. • g Keep the tip the soldering iron clean. Please review the parts construction and characteristics. Therefore, the following precautions are provided for soldering relay onto board. Solder tem perature 260°C ±5°C 500°F±41°F Soldering tim ithin approx. Note that the board is pressed down hard enough, flux may even penetrate flux-resistant type relay. Use rosin-based non-corrosive flux. This must observed especially for dust-cover type relays. • Unless otherwise specified, solder under the following conditions depending the type relay. (Be sure that the relays don't rattle. The type protective structure will determine suitability for automatic soldering autom atic cleaning. Relay performance may degrade due the high thermal capacity these boards. f \ Bad exam ple 2 lic tio n Adjust the position the board so that flux does not overflow onto the top of it. seconds • Please take caution with ulti-layer boards. • Adjust the level solder that does not overflow onto the top the PC board. 4 g • tic g • Flow solder the optimum method for soldering. Never use this method. Solderability also improves. See “Configuration and Construction” page 72.Excerpts from Technical Information RELAY SOLDERING AND CLEANING GUIDELINES In keeping with making devices compact, it becoming more common weld the relay board along with the sem iconductors instead using the previous plug-in type which relays were plugged into sockets. Relay performance cannot guaranteed if the term inals are bent. inutes • Note that long exposure high tem peratures (e. 1. This could impair relay performance. seconds 66 . • Correctly drill the board according to the given board pattern illustration. If the board pressed down into a flux-soaked sponge shown the right, the flux can easily penetrate a dust-cover type relay. Tem perature 120°C 248°F less Time ithin approx. • Preheat according the following conditions.) Interference may occur internally the gripping force the tab of the surface mounting machine too great. Self-clinching term inal types are available depending on the type relay. • Stick packaging also available for autom atic mounting, depending the type relay.g