Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
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Adjust the position the board so
that flux does not overflow onto the top
of it. Never use this
method.
• Unless otherwise specified, solder
under the following conditions
depending the type relay.
Use rosin-based non-corrosive flux. This could impair relay
performance. Self-clinching
term inal types are available depending
on the type relay.
4 g
• tic g
• Flow solder the optimum method for
soldering.
• g
Keep the tip the soldering iron clean. (Be sure that the relays
don't rattle. Note that the board is
pressed down hard enough, flux may
even penetrate flux-resistant type
relay. For dust-cover
type relays and flux-resistant type
relays, preheating acts prevent the
penetration flux into the relay when
soldering. inutes
• Note that long exposure high
tem peratures (e. ith this
style, loss function may occur because
of seepage into the relay flux, which is
applied the board.Excerpts from Technical Information
RELAY SOLDERING AND CLEANING GUIDELINES
In keeping with making devices compact,
it becoming more common weld the
relay board along with the
sem iconductors instead using the
previous plug-in type which relays
were plugged into sockets. seconds
• Please take caution with ulti-layer
boards. J
Be sure preheat before using
autom atic soldering. due a
malfunctioning unit) may affect relay
characteristics. Solderability also improves.
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3 tin g
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U U
n uV. Please
review the parts construction and
characteristics.) Interference may occur
internally the gripping force the tab
of the surface mounting machine too
great.
The type protective structure will
determine suitability for automatic
soldering autom atic cleaning. Relay performance may
degrade due the high thermal
capacity these boards. This must observed especially
for dust-cover type relays.
Soldering Iron 60W
Iron Tip
Tem perature
350°C 662°F
Soldering Time ithin approx.
• Correctly drill the board according
to the given board pattern
illustration.
• Stick packaging also available for
autom atic mounting, depending the
type relay.
• Preheat according the following
conditions.g. Relay
performance cannot guaranteed if
the term inals are bent.
• Adjust the level solder that does
not overflow onto the top the PC
board.
1.
If the board pressed down into a
flux-soaked sponge shown the
right, the flux can easily penetrate a
dust-cover type relay. See “Configuration and
Construction” page 72. tin y
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u u
• Avoid bending the term inals make
the relay self-clinching. seconds
66
.
Tem perature 120°C 248°F less
Time ithin approx. Therefore, the
following precautions are provided for
soldering relay onto board.
Solder
tem perature
260°C ±5°C 500°F±41°F
Soldering tim ithin approx.
Please refer them during installation in
order avoid problems
