Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
General tolerance: ±0.008
(Typical: 0.W. High frequency characteristics
Sam ple: J20A12
M easuring ethod: easured with board netw ork analyzer (HP8510C).
1.2
0 .3 ±.2
0 .3 ±.012
S tic tto )
Single side stable coil latching
Direction
indication
10
NC
9
" 5
6 ^
(Deenergized condition)
7 6
Com
10
NC
9
(Reset condition)
45MHz 8GHz
417
NO
5NO
480
2.
Expansion A:
C oplanarity term inals
& ribs base
0 0.409
Expansion A
à
@ ribs should soldered
with board ground.50
.15
.R.20 may obtained when thi
portion soldered with
PC board ground.
■V. Surface mount terminal
0. board's loss)
5GHz
Frequency
Isolation characteristics
-Frequency
DIMENSIONSm inch fro site .020
6.4
. Standard board terminal
10.
0.006
1 All bottom surface the base should be
touched closely soldered with board
ground.020
10.250
2 ribs should soldered
with board ground.008
0.00
0 to10.U.
General tolerance: ±0.20
.T.S.1)
(Typical: . characteristics Insertion loss characteristics
(w ithout D.012
Single side stable
Direction
indication
Com
7 6
S tic )
2 coil latching
(Deenergized condition)
(Reset condition)
ds_61313_en_rj: 010611J 19
5
NO5
4NO
4
.4
409 50
.004)
2 Better characteristics
may obtained when thi
portion soldered with
PC board ground.008
(Typical: 0.6
10.36
.
9.
1 All bottom surface the base should be
touched closely soldered with board
ground.(ARJ)
REFERENCE DATA
1.004)
2 Better characteristics
8.1)
(Typical:
