Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
Insertion Mount Technology (IMT) vs.
642 ds_x61_en_relay_technical_information_091112D
.
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re ith d
h tre fro flo rin g
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W lie rie fro m
o to
p rfo e
e tro tic tib ith
s rfa S
a . Surface Mount Technology (SMT)
InsertionMounting
Technology(IMT)
SurfaceMountTechnology
(SMT)
Components’leadsareinsertedinto
leadholesdrilledintothePCboard
andaresolderedtocopperpadson
theothersideoftheboardusing
flow-solderingtechniques.
p llo rib s
p fro rtio tin tio ire rfa e
[1] What Surface Mount Relay?
1. Features and Effects
Features Effects
•Allowshighdensitymounting
•Componentscanbeinstalledonbothsidesofaboard
•CeramicPCboardscanbeused
t
Systemdownsizing
•Compatiblewithautomaticplacementbyrobots
•Drillingforleadholesisnotrequired
•Compactsystemdesignsarepossibleduetohighdensitymounting
Overallcostreduction
•Highheatresistance
•Anti-gasmeasures Highreliability
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G is
R lia ility t
P t-
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3. In
c tra tio tro
m tin id
co ils, rin ry
s itiv tre fro flo w
so rin .SMT Soldering Guidelines
SMT SOLDERING GUIDELINES
CAUTIONS FOR SURFACE MOUNT RELAY INSTALLATION
T rfa tin lla tio t
d lle lig ffe lin rfa lfu tio rre tio . Examples SMT Applications
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o lic tio :
• fra flo rin (IR )
IR flo rin g
te ila rfa e
m tin r
in fra its C
b lie tin ly
s tra rre h
a ris a
p tin tin lin .
Componentsareplacedoncopper
padsprecoatedwithpastesolder
andtheboardassemblyisheatedto
solderthecomponentsonthepads
(reflowsoldering).
A lie tra rre a
th t-re y
a fro s
p belt. From IMT SMT
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(IM ith is
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te ).
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tra rre lte r
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O flo rin s
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p .
• rin )
W ith lie s
a rrie tiv e
s rin t
h sta e
s C
b rfa ltin tio n
h flo w
s rin .
Relay
Relay Clip resistance
Resistor
PC board
PC board
1C
2
