Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
) and coating in
order prevent negative impacts on
relay characteristics. Sufficient
verification under actual processing
conditions required.
• Cautions for mounting operations
Temperature profile indicates the
temperature the soldered part (*1) of
terminals the surface circuit
board.
t2 Less than sec.
70% RH).CP
NOTES
1.
2) products are not used within days
after opening moisture-prevention
package, store them humidity-
controlled desiccator storage bag
with silica gel.
2) Avoid cleaning (ultrasonic cleaning,
boiling cleaning, etc.
ds_61207_en_cp: 010113J 47
Automotive
. Storage condition after opening a
moisture-prevention package
1) After opening moisture-prevention
package, use the item soon as
possible (within days under an
environment Max. The exterior temperature a
relay may extremely high depending
on the component density the board
or the heating method the reflow oven
or circuit board type. Mounting and cleaning conditions
for SMT type relays
1) Recommended reflow condition is:
• Reflow-soldering temperature profile
condition (IRS method)
A
/ \
-4------------- --------------►•*- -►
2.
Ti 150 180°C 302 356°F
T2 230°C 46°l more
T3 Less than 260°C 500°F
ti 120 sec. 30°C 86°F, Max.
For Cautions for Use, see Relay Technical Information (page 166)
