Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
004
1 .
2x.(ACJ)
5.
2x.118 inch: ±0.0 dia.6
XX ,,T 2X.059 dia. 1mm .013
10.
Tolerance: ±0.
2x1.004
Schematic (Bottom view)
!NC
NpCcOIL COM
NOTES
Assembly and cleaning conditions for Pi
1) Example the recommended
conditions for automated assembly is
shown below.5 dia.010
4 0.012
Dimensions (thickness and width) terminal measured before pre-soldering.010
Sealed epoxy resin
PC board pattern (Bottom view)
4i Dim ension: Tolerance
Max. . .1 ±.2 ±.012
1.039 dia.008
Min.
2x1.
2x.
2x. 1mm .059 dia.
6.008
Min.157 .039 .1 ±. Also, use caution for
avoiding penetration soldering flux into
the interior the relay.
2) Cleaning coating should avoided.
Because “Pin-in-Paste” type not a
sealed type.
Therefore, please set the temperature of
soldering portion relay terminal and the
top surface the relay case not to
exceed the above mentioned soldering
condition. recommended check the
temperature rise each portion under
actual mounting condition before use.012
2x1.118 inch: ±0.5 dia. Slim Form C
Standard type
r Tai
External dimensions
i
^Pre-soldering (all terminals)
2x0.32_
'.0 dia. Slim Form C
Pin Paste type
r CADDTai
External dimensions board pattern (Bottom view)
A surface
level
Sealed epoxy resin
2x0.039 dia.
Intervals between terminals measured surface level.
• Temperature profile during reflow-
soldering (Recommended)
Ti 150 180°C 302 356°F
T2 230°C 16°F more
T3= Less than 260°C 500°F
ti 120 sec.
0.118 inch: ±0.
32
-in-Paste type
• Cautions for mounting
Temperature rise relay itself may vary
according the mounting level the
heating method reflow equipment.2 ±.1 ±.
0.1 ±.059 dia.25 2x.039 inch: ±0.45___
11
Dim ension: Tolerance
Max.6
2x0 2x0.004
1 .118 inch: ±0.02^ 2x0.
.5 dia.
ds_61215_en_cj: 010113D
.
Intervals between terminals measured surface level.039 .3 ±.3
.039 inch: ±0.
2x1.3
.3 ±.
t2 Less than sec.25 2x.004
Schematic (Bottom view)
Dimensions (thickness and width) terminal measured before pre-soldering.012
Tolerance: ±0
