Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
0 dia.059 dia.118 inch: ±0.
ds_61215_en_cj: 010113D
.010
4 0.(ACJ)
5. 1mm .
6.039 dia.059 dia.118 inch: ±0.5 dia.1 ±.004
1 .2 ±.2 ±.5 dia.008
Min.039 .
2x1.
Intervals between terminals measured surface level.1 ±.1 ±.012
1.
32
-in-Paste type
• Cautions for mounting
Temperature rise relay itself may vary
according the mounting level the
heating method reflow equipment.039 .
2x1.0 dia.
.
Tolerance: ±0.039 dia.3 ±.039 inch: ±0.118 inch: ±0.
• Temperature profile during reflow-
soldering (Recommended)
Ti 150 180°C 302 356°F
T2 230°C 16°F more
T3= Less than 260°C 500°F
ti 120 sec.6
XX ,,T 2X.3
.3
.008
Min.
2x.013
10.02^ 2x0.039 inch: ±0.004
1 .012
Tolerance: ±0.6
2x0 2x0.
2x1. recommended check the
temperature rise each portion under
actual mounting condition before use.157 . Slim Form C
Pin Paste type
r CADDTai
External dimensions board pattern (Bottom view)
A surface
level
Sealed epoxy resin
2x0.45___
11
Dim ension: Tolerance
Max. Slim Form C
Standard type
r Tai
External dimensions
i
^Pre-soldering (all terminals)
2x0.012
Dimensions (thickness and width) terminal measured before pre-soldering.25 2x.004
Schematic (Bottom view)
!NC
NpCcOIL COM
NOTES
Assembly and cleaning conditions for Pi
1) Example the recommended
conditions for automated assembly is
shown below.059 dia.32_
'. .3 ±.25 2x. .004
Schematic (Bottom view)
Dimensions (thickness and width) terminal measured before pre-soldering.012
2x1.1 ±.
Therefore, please set the temperature of
soldering portion relay terminal and the
top surface the relay case not to
exceed the above mentioned soldering
condition.010
Sealed epoxy resin
PC board pattern (Bottom view)
4i Dim ension: Tolerance
Max.
Intervals between terminals measured surface level.118 inch: ±0.
2x. Also, use caution for
avoiding penetration soldering flux into
the interior the relay.
t2 Less than sec.
2) Cleaning coating should avoided.5 dia. 1mm .
0.
2x.
2x.
Because “Pin-in-Paste” type not a
sealed type.
0
