Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.
R ste tin pad t
in the lica tio data quire relay
product. Examples SMT Applications
1. ouble rin fte are glue ard surface, the ard sse tra sfe rre a
m lten ith side cin Then, are
so board.AUTOMOTIVE CAUTIONS FOR USE
3.
• tib ith product. hase rin ith a
F rin -70, bei
PC ard surface, the resulti
sse lie are r
en ated vap
ig tio he
' *..
4. flo rin includ utilizin lasers, air, lse heaters.*..ml 1mm —^
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2.
------------Cooling coil
------------Saturated vapor
------------Heater
3. or
p ssib sto riod fte ckage, lea the ct
co cts are used ith ssib sto riod, stored
in ity-co tro lle istu tio bag ith silica gel.
F ith thod the ste be
co ria s
to ttin and te
insula tion.. ositiona lig and circ it
bo ard ire precise sitio its rin pads.
Screen Printing
PC board
Solder Dispenser
Syringe
Paste solder
(for dispenser)
Squeegee
Paste solder
(for screen printing)
J Mask
Pad
PC board
• lf-a lig ffe cte ring rin lig ppro 100 g
o less) such chip such ffe cte tro
m ica such lays. elt flo oven lie are tra sfe rre thin, t-re are by
th fro placed neath the belt..
..
P aste lie board
w ith scre prin ting s.
so rin ila rfa unting a
p its sou rce.
M unting be
d sig rro hile
ta kin ility and insula tion.. ard sse lie are tin sly sold d
h rise tin ating, lin
, Preheat Heating Cooling .
• xce ssive ickup rce rte cou cau inte rnal age and
p rfo arra .
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184 ds_x61_en_relay_technical_information_010113J
. the the
at vid the flo solde ring ....
• nce the ity tro lle cka ened used rom ptly.*
le cia inactive solven such as
o state.
5. Infrare flo rin (IR IRS reflov
sh infrared lam
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stag es
