RELAYS Panasonic

| Kategorie: Katalog  | Tento dokument chci!

Panasonic is part of a large worldwide groupselling relays and associated switching products under different brand names in different territories.The conditions of use in some territories may differ from those customary in Europe. In particular there are often major differences in regard to national and international specifications, such as UL, CSA, VDE, SEV, EVE, SEMKO, etc. Thus, when considering contact loads as stated in this catalogue (e.g. 10 A, 30 VDC for the SP relay) its hould be understood that these values are not necessarily an absolute maximum but tested ratings. Mostly the stated value has been tested for a certain life expectancy as stated by the manufacturer or the respective test house. Thus, under different conditions, the stated “maximum” may, in practice, be safely exceeded.

Vydal: Panasonic Electric Works Czech s.r.o. Autor: Panasonic

Strana 972 z 1090

Vámi hledaný text obsahuje tato stránku dokumentu který není autorem určen k veřejnému šíření.







Poznámky redaktora
products, boards also need mount relays. • Other Technologies Other reflow soldering technologies include those utilizing lasers, hot air, and pulse heaters. Relay Resistor PC board Surface Mount Technology (SMT) Components are placed copper pads precoated with paste solder and the board assembly heated to solder the components the pads (reflow soldering). ds_x61_en_relay_technical_information_091112D 33 . W ith VPS technology, PCB assemblies are carried through special inactive solvent, such Fluorinert FC-70, that has been heated vapor state. W applied the experience gained from our advanced relay technologies to produce high-perform ance electrom agnetic relays com patible with surface mount technologies such IRS and VPS. the saturated vapor condenses the PC board surface, the resulting evaporation heat provides the energy for reflow soldering. The following describes proceed from Insertion mounting some cautions required for surface [1] What Surface Mount Relay? 1. The board assem bly is transferred through molten solder fountain (with the com ponent side facing down), and the com ponents are soldered to the board. T Conventional insertion mount technology (IMT) with some years history is now being replaced with surface mount technology (SMT). Solid-state com ponents such as resistors, ICs, and diodes can withstand high heat stresses from reflow soldering because they use mechanical parts. S ) Insertion Mounting Technology (IMT) Components’ leads are inserted into lead holes drilled into the board and are soldered copper pads on the other side the board using flow-soldering techniques. Relay Clip resistance PCboard '' 2 ffe ts Features Effects • Allows high density mounting • Components can installed both sides board • Ceramic boards can used t System downsizing • Compatible with automatic placement robots • Drilling for lead holes not required • Compact system designs are possible due high density mounting Overall cost reduction • High heat resistance • Anti-gas measures High reliability _The surface mount relay anufactured with the following advanced technologies: Heat-resistance encapsulation technique Gas analysis Reliability assessm ent Precision molding technique for heat- resistant materials 3 lic tio s The following describes some examples of typical SMT applications: • Infrared Reflow Soldering (IRS) IRS the most popular reflow soldering technology now available for surface mounting. • tio (IM .SMT Soldering Guidelines SMT SOLDERING GUIDELINES CAUTIONS FOR SURFACE MOUNT RELAY INSTALLATION To meet the market demand for surface mounting technology. In contrast, the conventional electro­ mechanical relays consisting solenoid coils, springs, and arm atures are very sensitive therm stress from reflow soldering. PC board assem blies are continuously soldered they are transferred through a tunnel furnace comprised a preheating, heating, and cooling-stages. • Double ave Soldering (DW S) Com ponents are glued the board surface. meet mount relay installation prevent downsizing smaller, lighter, and thinner this need, offer line surface malfunction and incorrectoperation. As PCB assem blies are transferred a thin, heat-resistant belt conveyer, they are soldered the heat from hotplates placed begeath the conveyer belt. uses sheath heater or infrared lamp its heat source